underfilladhesive1

China, Huizhou City,

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Children's Story

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DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA... DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that impro More »

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